PARMI SIGMA X 3D SPI 2019

The PARMI SIGMA X 3D SPI (2019 vintage) is a high-performance inline solder paste inspection system engineered to deliver accurate volumetric measurement and stable process control in modern SMT production environments. Built on PARMI’s structured light 3D measurement technology, the SIGMA X analyzes solder paste height, area, volume, and offset to prevent print-related defects before component placement. By detecting insufficient paste, excess paste, bridging risk, and misalignment at the earliest stage, the system helps reduce downstream rework and improve overall yield. This unit is configured with PARMI’s 3D optical projection system, high-resolution camera system, precision PCB transport module, industrial PC with operator interface, and standard signal cables, ensuring seamless integration into inline SMT production lines. The SIGMA X is suitable for automotive electronics, telecom assemblies, LED drivers, industrial control boards, and other high-reliability PCBA manufacturing environments where solder printing quality directly impacts final product performance. Machine configured for standard left-to-right PCB flow SMT line integration.