Back to SMT LinesBalanced Throughput for Structured Growth
Balanced Throughput for Structured Growth
Up to 40,000 CPH • Multi-SKU Flexibility • Expandable Architecture
Up to 40,000 CPHMulti-SKU FlexibilityExpandable Design
Designed for growing EMS and OEM manufacturers requiring higher placement speed, improved feeder capacity and stable production across multiple PCB assemblies.
Line Overview
This mid-level SMT production line increases throughput while maintaining process flexibility and placement accuracy. It is structured for manufacturers handling multiple SKUs, moderate-to-high volume batches and evolving production requirements.
Each configuration is planned around:
- PCB complexity and component density
- Target CPH output
- Feeder capacity requirements
- Floor space availability
- Future expansion strategy
Typical SMT Line Structure
LoaderPrinterDual Gantry Pick & PlaceReflow OvenAOIUnloader
Dual gantry architecture improves placement efficiency and supports balanced feeder distribution.
Performance Snapshot
Maximum Placement Speed
Up to 40,000 CPH
Component Capability
0201 ready
Feeder Configuration
Dual-side feeder bank
Expandability
Additional PnP integration possible
Scale Your Production with Confidence.
Get a structured proposal tailored to your production plan.
