Koh Young KY8030-3 3D SPI 2020

The Koh Young KY8030-3 (2020 vintage) is a high-performance 3D Solder Paste Inspection (SPI) system designed to deliver precise volumetric measurement and process control in advanced SMT production lines. Built on Koh Young’s proven true 3D measurement platform, the KY8030-3 accurately analyzes solder paste volume, height, area, offset, and shape to prevent printing defects before component placement. Unlike conventional 2D inspection systems, this machine provides real 3D volumetric data, enabling tighter process control and reduced defect rates. This unit is configured with Koh Young’s 3D projection measurement system, high-resolution camera system, precision PCB transport system, operator console, and standard signal cables, ensuring seamless integration into existing SMT lines. The KY8030-3 is ideal for automotive electronics, telecom boards, industrial control systems, LED drivers, and high-reliability PCB assemblies where solder quality is critical. Machine configured for standard left-to-right PCB flow SMT line integration.