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KOH YOUNG KY8030-2 3D SPI 2010

Solder Paste Inspection | Koh Young

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Description

The Koh Young KY8030-2 is a high-performance 3D solder paste inspection (SPI) system utilizing advanced shadow-free Moiré technology for precise volumetric measurement. Configured in L-size format with 15 µm camera resolution, the system delivers accurate paste height, area, and volume inspection across complex PCB assemblies. Designed for medium to high-volume SMT production lines, the KY8030-2 supports automatic conveyor width adjustment and advanced defect detection including insufficient paste, excess paste, bridging, and offset errors. Equipped with ePM-SPI programming software and SPC@KSMART monitoring, the system ensures stable process control and production traceability.

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Technical Specifications

Parameter	Description / Value
Inspection Technology	3D Shadow-Free Moiré
Camera Resolution	15 µm
PCB Size	50 × 50 mm to 510 × 510 mm
Inspection Speed	Up to 56 cm²/sec

Key Performance Features

3D shadow-free Moiré inspection

15 micron high-resolution camera

High-accuracy paste height measurement

L-size PCB support

Automatic conveyor width adjustment

Advanced defect detection

SPC process monitoring integration

Stable SMT line integration