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Fetching the latest SMT machines and specifications from Tekmart.
Fetching the latest SMT machines and specifications from Tekmart.
Reflow Oven | Heller
The Heller 1809 MK III is a high-performance forced convection reflow oven engineered for consistent thermal processing in SMT production environments. Featuring 9 independently controlled heating zones and efficient heat transfer technology, the system ensures stable and repeatable soldering performance. Designed for medium to high-volume manufacturing, the 1809 MK III delivers excellent temperature uniformity across the PCB while maintaining energy efficiency. Its modular heating architecture allows accurate profile tuning for lead-free and traditional soldering processes. The Heller 1809 MK III is widely used in EMS and OEM facilities requiring reliable and precise thermal processing for complex PCB assemblies.
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| Parameter | Description / Value |
|---|---|
| Heating Zones | 9 Zones (Top & Bottom Forced Convection) |
| Cooling Zones | 2 Zones |
| Total Zones | (9 Heating + 2 Cooling) |
| Maximum PCB Width | 510 mm |
| Conveyor Type | Mesh + Chain |
| Reflow Type | Air |
Air-based convection reflow
9-zone thermal control
Lead-free compatible
Stable temperature uniformity
High-volume SMT capability
Energy-efficient heating
Mesh conveyor transport
Reliable industrial operation