PARMI Xceed 3D AOI 2022

The PARMI Xceed 3D AOI (2022 vintage) is a next-generation high-precision automated optical inspection system designed for advanced SMT production lines requiring accurate 3D defect detection and reduced false call rates. Built on PARMI’s structured light 3D inspection platform, the Xceed system measures solder joint height, volume, shape, and component geometry with high accuracy. Unlike traditional 2D AOI systems, it delivers true 3D measurement data, enabling better detection of lifted leads, insufficient solder, solder bridges, coplanarity issues, polarity errors, and missing components. This 2022 unit is configured with PARMI’s high-resolution 3D optical system, multi-angle projection technology, advanced LED illumination system, precision PCB transport system, operator console, and standard signal cables, ensuring smooth inline integration and production readiness. The Xceed 3D AOI is ideal for automotive electronics, telecom boards, industrial control PCBs, LED assemblies, and high-reliability manufacturing environments where inspection accuracy directly impacts yield and quality. Configured for standard left-to-right PCB flow SMT line integration.