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Fetching the latest SMT machines and specifications from Tekmart.
Fetching the latest SMT machines and specifications from Tekmart.





Automated Optical Inspection | Omron
OMRON VT-S530 (2022 model) is a next-generation inline 3D Automated Optical Inspection system engineered for high-accuracy inspection of solder joints and component placement in advanced SMT manufacturing. Equipped with enhanced 3D measurement technology and intelligent defect classification, the VT-S530 delivers highly accurate height, volume, and shape analysis of solder joints. The system is capable of detecting lifted leads, insufficient solder, bridging, polarity errors, misalignment, and other complex assembly defects with high repeatability. Designed for fine-pitch, BGA, QFN, CSP, and high-density PCB applications, it significantly improves first-pass yield and process control. This unit is tested for optical calibration, 3D height accuracy, motion stability, and conveyor performance before dispatch. Ideal for EMS and OEM manufacturers focused on premium soldering quality and Industry 4.0 integration.
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| Parameter | Description / Value |
|---|---|
| Measurement Technology | Advanced 3D Shape Measurement + High-Resolution 2D Imaging |
| Max PCB Size | Up to 510 × 460 mm |
| Inspection Capability | Solder Volume, Height, Bridging, Lifted Leads, Missing, Polarity |
| PCB Flow Direction | Left → Right |
True 3D solder inspection
High-speed inspection capability
Advanced defect classification
Accurate height and volume measurement
Fine-pitch compatible
Smart factory connectivity ready
Stable inline integration
Improves first-pass yield