MIRTEC MV-9 3D AOI System 2014

MIRTEC MV-9 (2014 vintage) is a high-performance 3D In-line Automatic Optical Inspection system designed for accurate solder joint and component inspection in SMT production lines. The system is equipped with a 15-megapixel top camera with 10 µm resolution, combined with four 10-megapixel side cameras for comprehensive inspection coverage. This configuration enables precise 3D inspection of solder fillets, lifted leads, bridging, insufficient solder, and component alignment issues. The side-view camera architecture provides enhanced detection of lead defects and shadowed areas, making it ideal for fine-pitch, QFN, and BGA assemblies. Configured as a single-lane inline system with support up to 510 × 460 mm PCB size, the MV-9 delivers stable inspection performance for EMS and OEM manufacturers focused on soldering quality and process control. The unit is tested for camera calibration, 3D measurement accuracy, and conveyor stability before dispatch.