MIRTEC MV-7Xi 3D AOI System 2014

High-precision 3D inline AOI system from MIRTEC designed for accurate solder joint and component inspection in SMT production lines. Long Description: MIRTEC MV-7Xi (2014 model) is a high-performance 3D In-line Automatic Optical Inspection system engineered for precise detection of solder joint and component placement defects. Equipped with advanced 3D inspection technology and high-resolution imaging, the MV-7Xi provides accurate measurement of solder height, volume, and fillet shape. The system effectively detects bridging, insufficient solder, lifted leads, polarity errors, misalignment, and missing components. Its 3D measurement capability enhances inspection reliability compared to conventional 2D AOI systems, making it ideal for fine-pitch, QFN, BGA, and high-density PCB assemblies. Configured for inline SMT production, the machine is tested for camera calibration, 3D height accuracy, and conveyor stability before dispatch. Suitable for EMS and OEM manufacturers focused on soldering quality and yield improvement.